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STM32F107RC bảng dữ liệu(PDF) 83 Page - STMicroelectronics

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Giải thích chi tiết về linh kiện  Connectivity line, ARM®-based 32-bit MCU with 64/256 KB Flash, USB OTG, Ethernet, 10 timers, 2 CANs, 2 ADCs, 14 communication interfaces
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STM32F107RC bảng dữ liệu(HTML) 83 Page - STMicroelectronics

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STM32F105xx, STM32F107xx
Package information
107
Figure 41. LFBGA100 – 100-ball low profile fine pitch ball grid array, 10 x 10 mm,
0.8 mm pitch,
package recommended footprint
Figure 40. LFBGA100 – 100-ball low profile fine pitch ball grid array, 10 x 10 mm,
0.8 mm pitch, package mechanical data
Symbol
millimeters
inches(1)
1. Values in inches are converted from mm and rounded to 4 decimal digits.
Min
Typ
Max
Typ
Min
Max
A
-
-
1.700
-
-
0.0669
A1
0.270
-
-
0.0106
-
-
A2
-
0.300
-
-
0.0118
-
A4
-
-
0.800
-
-
0.0315
b
0.450
0.500
0.550
0.0177
0.0197
0.0217
D
9.850
10.000
10.150
0.3878
0.3937
0.3996
D1
-
7.200
-
-
0.2835
-
E
9.850
10.000
10.150
0.3878
0.3937
0.3996
E1
-
7.200
-
-
0.2835
-
e
-
0.800
-
-
0.0315
-
F
-
1.400
-
-
0.0551
-
ddd
-
-
0.120
-
-
0.0047
eee
-
-
0.150
-
-
0.0059
fff
-
-
0.080
-
-
0.0031
Table 58. LFBGA100 recommended PCB design rules (0.8 mm pitch BGA)
Dimension
Recommended values
Pitch
0.8
Dpad
0.500 mm
Dsm
0.570 mm typ. (depends on the soldermask
registration tolerance)
Stencil opening
0.500 mm
Stencil thickness
Between 0.100 mm and 0.125 mm
Pad trace width
0.120 mm



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