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STM32F107RC bảng dữ liệu(PDF) 47 Page - STMicroelectronics |
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STM32F107RC bảng dữ liệu(HTML) 47 Page - STMicroelectronics |
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47 / 108 page ![]() DocID15274 Rev 10 47/108 STM32F105xx, STM32F107xx Electrical characteristics 107 5.3.6 External clock source characteristics High-speed external user clock generated from an external source The characteristics given in Table 20 result from tests performed using an high-speed external clock source, and under ambient temperature and supply voltage conditions summarized in Table 9. APB2 (up to 72 MHz) APB2-Bridge 3.47 µA/MHz GPIOA 6.39 GPIOB 6.39 GPIOC 6.11 GPIOD 6.39 GPIOE 6.11 SPI1 3.61 USART1 12.08 TIM1 23.47 ADC1(4) 18.21 1. The BusMatrix is automatically active when at least one master is ON.(CPU, ETH-MAC, DMA1 or DMA2). 2. When I2S is enabled we have a consumption add equal to 0, 02 mA. 3. When DAC_OUT1 or DAC_OUT2 is enabled we have a consumption add equal to 0, 3 mA. 4. Specific conditions for measuring ADC current consumption: fHCLK = 56 MHz, fAPB1 = fHCLK/2, fAPB2 = fHCLK, fADCCLK = fAPB2/4. When ADON bit in the ADC_CR2 register is set to 1, a current consumption of analog part equal to 0.6 mA must be added. Table 19. Peripheral current consumption (continued) Peripheral Typical consumption at 25 °C Unit Table 20. High-speed external user clock characteristics Symbol Parameter Conditions Min Typ Max Unit fHSE_ext External user clock source frequency(1) - 18 50 MHz VHSEH OSC_IN input pin high level voltage 0.7VDD - VDD V VHSEL OSC_IN input pin low level voltage VSS - 0.3VDD tw(HSE) tw(HSE) OSC_IN high or low time(1) 1. Guaranteed by design, not tested in production. 5 - - ns tr(HSE) tf(HSE) OSC_IN rise or fall time(1) - - 20 Cin(HSE) OSC_IN input capacitance(1) - - 5 - pF DuCy(HSE) Duty cycle - 45 - 55 % IL OSC_IN Input leakage current VSS ≤VIN ≤VDD - - ±1 µA |
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