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STM32WB15CC bảng dữ liệu(PDF) 116 Page - STMicroelectronics

tên linh kiện STM32WB15CC
Giải thích chi tiết về linh kiện  Multiprotocol wireless 32-bit MCU Arm®-based Cortex®-M4 with FPU, Bluetooth® 5.2 radio solution
PDF  127 Pages
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nhà sản xuất  STMICROELECTRONICS [STMicroelectronics]
Trang chủ  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STM32WB15CC bảng dữ liệu(HTML) 116 Page - STMicroelectronics

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Package information
STM32WB15CC
116/127
DS13258 Rev 4
7
Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK packages, depending on their level of environmental compliance. ECOPACK
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK is an ST trademark.
7.1
UFQFPN48 package information
UFQFPN48 is a 48-lead, 7 x 7 mm, 0.5 mm pitch, ultra thin fine pitch quad flat package.
Figure 27. UFQFPN48 outline
1. Drawing is not to scale.
2. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint life.
3. There is an exposed die pad on the underside of the UFQFPN package, it must be electrically connected to
the PCB ground.
A0B9_ME_V3
D
Pin 1 identifier
laser marking area
EE
D
Y
D2
E2
Exposed pad
area
Z
1
48
Detail Z
R 0.125 typ.
1
48
L
C 0.500x45°
pin1 corner
A
Seating
plane
A1
b
e
ddd
Detail Y
T



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