MM9Z1 datasheet(13/452 Pages) NXP

13 / 452 page

NXP Semiconductors

MM9Z1_638

ELECTRICAL CHARACTERISTICS

Electrical characteristics

4.1

General

This section contains electrical information for the microcontroller and the analog die.

4.2

Absolute maximum ratings

Absolute maximum ratings are stress ratings only. A functional operation under or outside these maximums is not guaranteed. Stress

beyond these limits may affect the reliability, or cause permanent damage of the device.

This device contains circuitry protecting against damage due to high static voltage or electrical fields. However, it is advised that normal

precautions be taken to avoid application of any voltages higher than maximum rated voltages to this high-impedance circuit. Reliability

of operation is enhanced if unused inputs are tied to an appropriate voltage level. All voltages are with respect to ground, unless otherwise

noted.

Ratings

Symbol

Value

Unit

VSUP pin voltage

VVSUP

-0.3 to 42

VSENSE0, VSENSE1, VSENSE2 pin voltage with 2.2 k resistor in serial (1)

VVSENSE012

-40 to 42

VSENSE3 pin voltage with 2.2k resistor in serial (1)

VVSENSE3

-40 to 62

PTB0, PTB1, PTB2, and PTB3 Voltage

VPTB0-3

-0.3 to VDDX+0.3

PTB4 direct voltage

PTB4 with external 47 k serial resistor

VPTB4

-0.3 to 7.0

-27 to 42

PTB5 GND Switch current

IPTB5

1.0

ISENSEH and ISENSEL pin voltage

VISENSE

-0.5 to VDDA+0.25

ISENSEH and ISENSEL pin current

IISENSE

-1.0 to 1.0

LIN pin voltage

VBUS

-27 to 42

LIN pin current (internally limited)

IBUSLIM

on page 18

Voltage at VDDX

VDDX

-0.3 to 5.55

Voltage at VDDH

VDDH

-0.3 to 3.0

VDDH output current

IVDDH

internally limited

VDDX output current

IVDDX

internally limited

RESET_A pin voltage

VIN

-0.3 to VDDX+0.3

Table 4. Absolute maximum electrical ratings - analog die

Notes:

1.It has to be assured by the application circuit that these limits will not be exceeded, e.g. by ISO pulse 1.

Table 5. Maximum thermal ratings

Ratings

Symbol

Value

Unit

Storage temperature

TSTG

-55 to 150

°C

Package thermal resistance (2)

RθJA

32 typ.

°C/W

Notes:

2.RθJA value is derived using a JEDEC 2s2p test board

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