DLPA2000 datasheet(58/63 Pages) TI

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11 Device and Documentation Support

11.1 Device Support

11.1.1 Third-Party Products Disclaimer

TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT

CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES

OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER

ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.

11.1.2 Device Nomenclature

11.1.2.1 Device Markings

Pin (terminal) A1 corner identifier

YMZLLLS

DLPC342xZVB

Marking Definitions:

Line 1:

DLP Device Name: DLPC342x where x is a "0" for this device

Line 2:

YMZLLLS SC: Foundry lot code for semiconductor wafers and lead-free solder ball marking

YM: Year Month

Z, S: Assembly site

LLL: Assembly lot traceability

SC: Solder ball composition

e1: Indicates lead-free solder balls consisting of SnAgCu

G8: Indicates lead-free solder balls consisting of tin-silver-copper (SnAgCu) with silver content

less than or equal to 1.5% and that the mold compound meets TI's definition of green

Note

1. Engineering prototype samples are marked with an X suffix appended to the TI part number. For

example, 2512737-0001X.

2. See Section 7.3.1.1, for DLPC342x resolutions on the DMD supported per part number.

11.1.3 Video Timing Parameter Definitions

See Figure 11-1 for a visual description.

Active Lines Per Frame

(ALPF)

Defines the number of lines in a frame containing displayable data. ALPF is a

subset of the TLPF.

DLPC3420

DLPS232 – OCTOBER 2021

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