MCP37D11-80ESLASHTE datasheet(5/136 Pages) MICROCHIP

5 / 136 page

 2020 Microchip Technology Inc.

DS20006381A-page 5

MCP37D11-80: 80 MSPS 12-BIT PIPELINED ADC

1.0

PACKAGE PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS

FIGURE 1-1:

TFBGA-121 Package. See Table 1-1 for the pin descriptions. Decoupling capacitors

for reference pins and VBG are embedded in the package. Leave TP pins floating always.

Top View

SDIO VCM

REF1+ REF1-

REF0+ REF0-

AIN4-

AIN2+

SCLK

WCK/

Q8/Q4-

Q6/Q3-

Q2/Q1-

Q4/Q2-

Q10/Q5-

OVR-

WCK/

Q11/Q5

Q7/Q3+

Q3/Q1+

Q9/Q4+

Q5/Q2+

OVR+

GND

DVDD18

DVDD12

DVDD18

GND

DVDD18

DVDD12

DVDD18

DCLK-

SENSE

AVDD12

AVDD12 AVDD12

AVDD12

AVDD18 AVDD18

GND

CAL

GND

SLAVE ADR0

GND

ADR1

AIN4+

AIN5+

AIN5-

AIN6-

AIN6+

AIN7-

AIN7+

VCMIN+

GND

AIN3-

AIN3+

AIN1+

AIN1-

AIN0+

AIN0-

AIN2-

VCMIN-

GND

Q0/Q0- Q1/Q0+

DCLK+ RESET SYNC

GND

CLK+

CLK-

GND AVDD18

GND

(Not to Scale)

Analog

Digital

All others:

Supply Voltage

Notes:

• Die dimension: 8 mm x 8 mm x 1.08 mm.

• Ball dimension: (a) Ball Pitch = 0.65 mm, (b) Ball Diameter = 0.4 mm.

• Flip-chip solder ball composition: Sn with Ag 1.8%.

• Solder sphere composition: SAC-405 (Sn/Au 4%/Cu 0.5%).

VBG

(WCK) (OVR)

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