ISO6721 datasheet(7/54 Pages) TI

7 / 54 page

7.4 Thermal Information

THERMAL METRIC

(1)

ISO672x

ISO672xB

UNIT

DWV (SOIC)

D (SOIC)

8 PINS

RθJA

Junction-to-ambient thermal resistance

84.3

104.6

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

36.3

48.9

°C/W

RθJB

Junction-to-board thermal resistance

47.0

52.9

°C/W

ψJT

Junction-to-top characterization parameter

7.4

7.9

°C/W

ψJB

Junction-to-board characterization parameter

45.1

52.1

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

—

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

7.5 Power Ratings

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

ISO6720

Maximum power dissipation (both sides)

VCC1 = VCC2 = 5.5 V, TJ = 150°C, CL =

15 pF, Input a 25-MHz 50% duty cycle

square wave

71.2

PD1

Maximum power dissipation (side-1)

19.3

PD2

Maximum power dissipation (side-2)

51.9

ISO6721

Maximum power dissipation (both sides)

VCC1 = VCC2 = 5.5 V, TJ = 150°C, CL =

15 pF, Input a 25-MHz 50% duty cycle

square wave

72.7

PD1

Maximum power dissipation (side-1)

36.35

PD2

Maximum power dissipation (side-2)

36.35

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ISO6720-Q1, ISO6721-Q1

SLLSFF5C – JANUARY 2020 – REVISED MARCH 2021

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