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MC56F81663 bảng dữ liệu(PDF) 51 Page - NXP Semiconductors

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Table 20. External clock operation timing requirements (continued)
Characteristic
Symbol
Min
Typ
Max
Unit
Input high voltage overdrive by an external clock
Vih
0.85×VDD
V
Input low voltage overdrive by an external clock
Vil
0.3×VDD
V
1. See the "External clock timing" figure for details on using the recommended connection of an external clock driver.
2. The chip may not function if the high or low pulse width is smaller than 6.25 ns.
3. External clock input rise time is measured from 10% to 90%.
4. External clock input fall time is measured from 90% to 10%.
90%
50%
10%
90%
50%
10%
External
Clock
tPW
tPW
tfall
trise
VIL
VIH
Note: The midpoint is VIL + (VIH – VIL)/2.
Figure 9. External clock timing
11.3.2 Phase-Locked Loop timing
Table 21. Phase-Locked Loop timing
Characteristic
Symbol
Min
Typ
Max
Unit
PLL input reference frequency1
fref
8
8
16
MHz
PLL output frequency2
fop
200
550
MHz
PLL lock time3
tplls
100
µs
Allowed Duty Cycle of input reference
tdc
40
50
60
%
1. An externally supplied reference clock should be as free as possible from any phase jitter for the PLL to work correctly.
The PLL is optimized for 8 MHz input.
2. The frequency of the core system clock cannot exceed 100 MHz. If the NanoEdge PWM is available, the PLL output must
be set to 400 MHz.
3. This is the time required after the PLL is enabled to ensure reliable operation.
11.3.3 External crystal or resonator requirement
Table 22. Crystal or resonator requirement
Characteristic
Symbol
Min
Typ
Max
Unit
Frequency of operation
fXOSC
4
8
16
MHz
System modules
MC56F81xxx, Rev. 1.1, 12/2020
NXP Semiconductors
51



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