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GC5316 bảng dữ liệu(PDF) 70 Page - Texas Instruments

tên linh kiện GC5316
Giải thích chi tiết về linh kiện  HIGH-DENSITY DIGITAL DOWNCONVERTER AND UPCONVERTER
PDF  75 Pages
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Trang chủ  http://www.ti.com
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GC5316 bảng dữ liệu(HTML) 70 Page - Texas Instruments

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GC5316
SLWS154A − JANUARY 2004 − REVISED MARCH 2004
www.ti.com
70
7
Specifications
7.1
Absolute Maximum Ratings
PARAMETER
SYMBOL
MIN
MAX
UNITS
Pad ring supply voltage
VPAD
−0.3
4
V
Core supply voltage
VCORE
−0.3
1.8
V
Input voltage (undershoot and overshoot)
VIN
−0.5
VPAD+0.5
V
Clamp current for an input or output
−20
20
mA
Storage temperature
Tstg
−65
140
_C
Junction temperature
TJ
105
_C
Lead soldering temperature (10 seconds)
300
_C
ESD classification
Class 2 (Passed 2.5-kV HBM, 500-V CDM, 150-V MM)
Moisture sensitivity
Class 4 (4 days floor life at 30
°C/60%H)
Reflow conditions
JEDEC standard, 240
°C max
CAUTION:Exceeding the absolute maximum ratings (min or max) may cause permanent damage to the part. These
are stress only ratings and are not intended for operation.
7.2
Recommended Operating Conditions
PARAMETER
MIN
MAX
UNITS
Pad ring supply voltage, VPAD
3
3.6
V
Core supply voltage, VCORE
1.5
1.65
V
Supply voltage difference VPAD – VCORE
2
V
Temperature ambient, no air flow(1), TA
−40
85
°C
Junction temperature(2), TJ
105
°C
(1) Chips specifications in Tables 6.4 and 6.5 are production tested to100°C case temperature. QA tests are performed at 85°C.
(2) Thermal management will be required for full rate operation, see the following table and Section 7.4. The circuit is designed for junction temperatures
up to 125
°C. Sustained operation at elevated temperatures reduces long-term reliability. Lifetime calculations based on maximum junction temperature
of 105
°C.
7.3
Thermal Characteristics
THERMAL CONDUCTIVITY
388 BGA
UNITS
3 W
Theta junction-to-ambient (still air),
θJA
13.5
°C/W
Theta junction-to-ambient (2m/s estimated),
θJA2m
9.3
°C/W
Theta junction-to-case,
θJC
2.4
°C/W
(3) Air flow reduces θJA and is highly recommended.



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