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GC5316 bảng dữ liệu(PDF) 70 Page - Texas Instruments |
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GC5316 bảng dữ liệu(HTML) 70 Page - Texas Instruments |
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70 / 75 page ![]() GC5316 SLWS154A − JANUARY 2004 − REVISED MARCH 2004 www.ti.com 70 7 Specifications 7.1 Absolute Maximum Ratings PARAMETER SYMBOL MIN MAX UNITS Pad ring supply voltage VPAD −0.3 4 V Core supply voltage VCORE −0.3 1.8 V Input voltage (undershoot and overshoot) VIN −0.5 VPAD+0.5 V Clamp current for an input or output −20 20 mA Storage temperature Tstg −65 140 _C Junction temperature TJ 105 _C Lead soldering temperature (10 seconds) 300 _C ESD classification Class 2 (Passed 2.5-kV HBM, 500-V CDM, 150-V MM) Moisture sensitivity Class 4 (4 days floor life at 30 °C/60%H) Reflow conditions JEDEC standard, 240 °C max CAUTION:Exceeding the absolute maximum ratings (min or max) may cause permanent damage to the part. These are stress only ratings and are not intended for operation. 7.2 Recommended Operating Conditions PARAMETER MIN MAX UNITS Pad ring supply voltage, VPAD 3 3.6 V Core supply voltage, VCORE 1.5 1.65 V Supply voltage difference VPAD – VCORE 2 V Temperature ambient, no air flow(1), TA −40 85 °C Junction temperature(2), TJ 105 °C (1) Chips specifications in Tables 6.4 and 6.5 are production tested to100°C case temperature. QA tests are performed at 85°C. (2) Thermal management will be required for full rate operation, see the following table and Section 7.4. The circuit is designed for junction temperatures up to 125 °C. Sustained operation at elevated temperatures reduces long-term reliability. Lifetime calculations based on maximum junction temperature of 105 °C. 7.3 Thermal Characteristics THERMAL CONDUCTIVITY 388 BGA UNITS 3 W Theta junction-to-ambient (still air), θJA 13.5 °C/W Theta junction-to-ambient (2m/s estimated), θJA2m 9.3 °C/W Theta junction-to-case, θJC 2.4 °C/W (3) Air flow reduces θJA and is highly recommended. |
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