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STM32WLE4JC bảng dữ liệu(PDF) 140 Page - STMicroelectronics

tên linh kiện STM32WLE4JC
Giải thích chi tiết về linh kiện  Multiprotocol LPWAN 32-bit Arm® Cortex®-M4 MCUs, LoRa®, (G)FSK, (G)MSK, BPSK, up to 256KB Flash, 64KB SRAM
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STM32WLE4JC bảng dữ liệu(HTML) 140 Page - STMicroelectronics

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Package information
STM32WLE5/E4xx
140/145
DS13105 Rev 8
6.4
Package thermal characteristics
The maximum chip junction temperature (TJ max) must never exceed the values given in
Table 25: General operating conditions.
The maximum chip-junction temperature, TJ max (in °C), can be calculated using the
equation:
TJ max = TA max + (PD max x ΘJA)
where:
TA max is the maximum ambient temperature in °C.
ΘJA is the package junction-to-ambient thermal resistance, in °C/W.
PD max is the sum of PINT max and PI/O max (PD max = PINT max + PI/O max).
PINT max is the product of IDD and VDD, expressed in Watt. This is the maximum chip
internal power.
PI/O max represents the maximum power dissipation on output pins:
PI/O max = Σ (VOL × IOL) + Σ ((VDD – VOH) × IOH)
taking into account the actual VOL / IOL and VOH / IOH of the I/Os at low and high level in the
application.
When the SMPS is used, a portion of the power consumption is dissipated into the external
inductor, therefore reducing the device power dissipation. This portion depends mainly on
the inductor ESR characteristics.
As the radiated RF power is quite low (< 4 mW), it is not necessary to remove it from the
device power consumption.
RF characteristics (such as sensitivity, Tx power consumption) are provided up to 85 °C.
Table 98. Package thermal characteristics
Symbol
Parameter
Value
Unit
ΘJA
Thermal resistance junction-ambient
UFBGA73 - 5 x 5 mm
UFQFPN48 - 7 x 7 mm
WLCSP59
20.1
27.4
TBD
°C/W
ΘJB
Thermal resistance junction-board
UFBGA73 - 5 x 5 mm
UFQFPN48 - 7 x 7 mm
WLCSP59
20.2
11.7
TBD
ΘJC
Thermal resistance junction-top case
UFBGA73 - 5 x 5 mm
UFQFPN48 - 7 x 7 mm
WLCSP59
31.1
8.5
TBD



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