STM32F334C8U6TR datasheet(74/125 Pages) STMICROELECTRONICS

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Electrical characteristics

STM32F334x4 STM32F334x6 STM32F334x8

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DS9994 Rev 9

Designing hardened software to avoid noise problems

EMC characterization and optimization are performed at component level with a typical

application environment and simplified MCU software. It must be noted that good EMC

performance is highly dependent on the user application and the software in particular.

Therefore it is recommended that the user applies EMC software optimization and

prequalification tests in relation with the EMC level requested for his application.

Software recommendations

The software flowchart must include the management of runaway conditions such as:

•

Corrupted program counter

•

Unexpected reset

•

Critical Data corruption (for example control registers)

Prequalification trials

Most of the common failures (unexpected reset and program counter corruption) can be

reproduced by manually forcing a low state on the NRST pin or the Oscillator pins for 1

second.

To complete these trials, ESD stress can be applied directly on the device, over the range of

specification values. When unexpected behavior is detected, the software can be hardened

to prevent unrecoverable errors occurring (see the “Software techniques for improving

microcontrollers EMC performance” application note (AN1015)).

Electromagnetic interference (EMI)

The electromagnetic field emitted by the device are monitored, while a simple application is

executed (toggling 2 LEDs through the I/O ports). This emission test is compliant with the

IEC 61967-2 standard that specifies the test board and the pin loading.

Table 45. EMS characteristics

Symbol

Parameter

Conditions

Level/

Class

VFESD

Voltage limits to be applied on any I/O pin to

induce a functional disturbance

VDD = 3.3 V, LQFP64, TA = +25°C,

fHCLK = 72 MHz

conforms to IEC 61000-4-2

VEFTB

Fast transient voltage burst limits to be

applied through 100 pF on VDD and VSS

pins to induce a functional disturbance

VDD = 3.3 V, LQFP64, TA = +25°C,

fHCLK = 72 MHz

conforms to IEC 61000-4-4

Table 46. EMI characteristics

Symbol Parameter

Conditions

Monitored

frequency band

Max vs. [fHSE/fHCLK]

Unit

8/72 MHz

SEMI

Peak level

VDD = 3.6 V, TA =25 °C,

LQFP64 package

compliant with IEC

61967-2

0.1 to 30 MHz

dBµV

30 to 130 MHz

130 MHz to 1GHz

SAE EMI Level

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