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công cụ tìm kiếm bảng dữ liệu linh kiện điện tử |
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công cụ tìm kiếm bảng dữ liệu linh kiện điện tử |
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XIO2001IPNP bảng dữ liệu(PDF) 16 Page - Texas Instruments |
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XIO2001IPNP bảng dữ liệu(HTML) 16 Page - Texas Instruments |
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16 / 144 page  16 XIO2001 SCPS212I – MAY 2009 – REVISED JANUARY 2016 www.ti.com Product Folder Links: XIO2001 Submit Documentation Feedback Copyright © 2009–2016, Texas Instruments Incorporated (1) For more details, refer to TI application note IC Package Thermal Metrics (SPRA953). 6.4 Thermal Information (1) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT PNP θJA Junction-to-free-air thermal resistance Low-K JEDEC test board, 1s (single signal layer), no air flow 50.8 °C/W High-K JEDEC test board, 2s2p (double signal layer, double buried power plane), no air flow 24.9 θJC Junction-to-case thermal resistance Cu cold plate measurement process 18.9 °C/W θJB Junction-to-board thermal resistance EIA/JESD 51-8 14.6 °C/W ψJT Junction-to-top of package EIA/JESD 51-2 0.26 °C/W ψJB Junction-to-board EIA/JESD 51-6 7.93 °C/W TA Operating ambient temperature range XIO2001PNP 0 70 °C XIO2001IPNP –40 85 TJ Virtual junction temperature XIO2001PNP 0 105 °C XIO2001IPNP –40 105 ZAJ θJA Junction-to-free-air thermal resistance Low-K JEDEC test board, 1s (single signal layer), no air flow 82 °C/W High-K JEDEC test board, 2s2p (double signal layer, double buried power plane), no air flow 58.8 θJC Junction-to-case thermal resistance Cu cold plate measurement process 19 °C/W θJB Junction-to-board thermal resistance EIA/JESD 51-8 32 °C/W ψJT Junction-to-top of package EIA/JESD 51-2 0.5 °C/W ψJB Junction-to-board EIA/JESD 51-6 30 °C/W TA Operating ambient temperature range XIO2001ZGU 0 70 °C XIO2001IZGU –40 85 TJ Virtual junction temperature XIO2001ZGU 0 105 °C XIO2001IZGU –40 105 ZGU θJA Junction-to-free-air thermal resistance Low-K JEDEC test board, 1s (single signal layer), no air flow 85 °C/W High-K JEDEC test board, 2s2p (double signal layer, double buried power plane), no air flow 48.3 θJC Junction-to-case thermal resistance Cu cold plate measurement process 8.5 °C/W θJB Junction-to-board thermal resistance EIA/JESD 51-8 25.4 °C/W ψJT Junction-to-top of package EIA/JESD 51-2 0.5 °C/W ψJB Junction-to-board EIA/JESD 51-6 24 °C/W TA Operating ambient temperature range XIO2001ZGU 0 70 °C XIO2001IZGU –40 85 TJ Virtual junction temperature XIO2001ZGU 0 105 °C XIO2001IZGU –40 105 |
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