MCP2517FD datasheet(89/98 Pages) MICROCHIP

tên linh kiện	MCP2517FD

Giải thích chi tiết về linh kiện	External CAN FD Controller with SPI Interface

PDF	98 Pages

Scroll/Zoom	100%

nhà sản xuất	MICROCHIP [Microchip Technology]

Trang chủ	http://www.microchip.com

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89 / 98 page

 2017-2018 Microchip Technology Inc.

DS20005688B-page 89

MCP2517FD

RECOMMENDED LAND PATTERN

Dimension Limits

Units

Optional Center Pad Width

Optional Center Pad Length

Contact Pitch

4.25

1.65

MILLIMETERS

0.65 BSC

MIN

MAX

Contact Pad Length (X14)

Contact Pad Width (X14)

0.85

0.35

Microchip Technology Drawing C04-3198A

NOM

Contact Pad Spacing

3.00

Contact Pad to Center Pad (X14)

0.25

Thermal Via Diameter

Thermal Via Pitch

0.30

1.00

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

Dimensioning and tolerancing per ASME Y14.5M

For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during

reflow process

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

ØV

SILK SCREEN

14-Lead Very Thin Plastic Quad Flat, No Lead Package (JHA) - 4.5x3.0 mm Body

[VDFN] With Dimpled Wettable Flanks

Spacing Between Contacts (X12)

0.30

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