R200 datasheet(28/51 Pages) INTEL

tên linh kiện	R200

Giải thích chi tiết về linh kiện	Embedded Infrared Assisted Stereovision 3D Imaging System with Color Camera

PDF	51 Pages

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nhà sản xuất	INTEL [Intel Corporation]

Trang chủ	http://www.intel.com

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System Integration

334616-001

Figure 7-4. Receptacle Ground Bar Motherboard Connections

7.7

Shielding

Testing should be done to quantify the level of shielding required. Typically, if the

R200 is placed greater than 2-3” from system antennas, only the cable may require

shielding.

•

The cable should be wrapped end to end with a conductive EMI fabric. The

fabric should make contact with the connector plug shield on each end.

•

The conductive fabric should make a ground connection with the system

chassis.

•

Between the cable shielding and the module shielding, the opening should be

as small as possible to avoid RFI leakage.

•

Component placement and cable routing must be optimized to minimize noise

pickup from system sources.

•

The RFI value should not increase more than 5dB when the R200 is active

compared to when inactive.

Conductive shielding material must not make contact with any non-GND

subassembly components, pads, or signals.

R200 bảng dữ liệu(PDF) 28 Page - Intel Corporation