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PACKAGE OUTLINE

C

16X

0.30

0.18

1.66 0.1

16X

0.5

0.3

0.8

0.7

(0.1) TYP

0.05

0.00

12X 0.5

4X

1.5

A

3.15

2.85

B

3.15

2.85

WQFN - 0.8 mm max height

RTE0016J

PLASTIC QUAD FLATPACK - NO LEAD

4224278/A 05/2018

PIN 1 INDEX AREA

0.08

SEATING PLANE

1

4

9

12

5

8

16

13

(OPTIONAL)

PIN 1 ID

0.1

C A B

0.05

EXPOSED

THERMAL PAD

17

SYMM

SYMM

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.

SCALE 3.600

30

DRV8428E, DRV8428P

SLOSE51 – JUNE 2020

www.ti.com

Product Folder Links: DRV8428E DRV8428P

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