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LSM6DSOPTR bảng dữ liệu(PDF) 1 Page - STMicroelectronics |
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LSM6DSOPTR bảng dữ liệu(HTML) 1 Page - STMicroelectronics |
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1 / 107 page  This is information on a product in full production. February 2020 DocID032926 Rev 5 1/107 LSM6DSOP iNEMO inertial module: always-on 3D accelerometer and 3D gyroscope Datasheet - production data Features Power consumption: 0.55 mA in combo high- performance mode “Always-on" experience with low power consumption for both accelerometer and gyroscope Smart FIFO up to 9 kbytes ±2/±4/±8/±16 g full scale ±125/±250/±500/±1000/±2000 dps full scale Analog supply voltage: 1.71 V to 3.6 V Independent IO supply (1.62 V) Compact footprint: 2.5 mm x 3 mm x 0.83 mm SPI / I²C serial interface with main processor data synchronization Standard interrupts: wakeup, 6D/4D orientation, activity/inactivity recognition, stationary/motion detection Programmable Finite State Machine: accelerometer, gyroscope Embedded temperature sensor ECOPACK, RoHS and “Green” compliant Applications Specific for smart pen applications Description The LSM6DSOP is a system-in-package featuring a 3D digital accelerometer and a 3D digital gyroscope boosting performance at 0.55 mA in high-performance mode and enabling always-on low-power features for an optimal motion experience for the consumer. The LSM6DSOP has been designed for smart pen applications, offering multiple power modes and also real, virtual and batch sensors with 9 kbytes for dynamic data batching. ST’s family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes. The various sensing elements are manufactured using specialized micromachining processes, while the IC interfaces are developed using CMOS technology that allows the design of a dedicated circuit which is trimmed to better match the characteristics of the sensing element. The LSM6DSOP has a full-scale acceleration range of ±2/±4/±8/±16 g and an angular rate range of ±125/±250/±500/±1000/±2000 dps. High robustness to mechanical shock makes the LSM6DSOP the preferred choice of system designers for the creation and manufacturing of reliable products. The LSM6DSOP is available in a plastic land grid array (LGA) package. For further information, please contact your local ST sales office or your distributor. LGA-14L (2.5 x 3 x 0.83 mm) typ. Table 1. Device summary Part number Temp. range [°C] Package Packing LSM6DSOPTR -40 to +85 LGA-14L (2.5x3x0.83 mm) Tape & Reel www.st.com |
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