Nexperia

BAS116L

Low-leakage diode

BAS116L

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Product data sheet

4 May 2016

4 / 12

9. Thermal characteristics

Table 6. Thermal characteristics

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

[1]

-

-

375

K/W

thermal resistance

from junction to

ambient

in free air

[2]

-

-

205

K/W

thermal resistance

from junction to solder

point

[3]

-

-

40

K/W

[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.

[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm².

[3] Soldering point of cathode tab.

aaa-022922

10

1

10

(K/W)

1

duty cycle = 1

0.05

0.01

0.5

0.33

0.25

0.2

0.1

0.02

0.75

0

FR4 PCB, standard footprint

Fig. 2. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values

aaa-022923

10

1

10

(K/W)

1

duty cycle = 1

0.05

0.01

0.5

0.33

0.25

0.2

0.1

0.02

0.75

0

Fig. 3. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values