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GD25VQ64CSIG bảng dữ liệu(PDF) 34 Page - GigaDevice Semiconductor (Beijing) Inc. |
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GD25VQ64CSIG bảng dữ liệu(HTML) 34 Page - GigaDevice Semiconductor (Beijing) Inc. |
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34 / 63 page ![]() 2.5V Uniform Sector Dual and Quad Serial Flash GD25VQ64C 34 When used to release the device from the Power-Down state and obtain the Device ID, the command is the same as previously described, and shown in Figure27, except that after CS# is driven high it must remain high for a time duration of tRES2 (See AC Characteristics). After this time duration the device will resume normal operation and other command will be accepted. If the Release from Power-Down / Device ID command is issued while an Erase, Program or Write cycle is in process (when WIP equal 1) the command is ignored and will not have any effects on the current cycle. Figure 26. Release Power-Down Sequence or High Performance Mode Sequence Diagram Figure 27. Release Power-Down/Read Device ID Sequence Diagram 7.23. Read Manufacture ID/ Device ID (REMS) (90H) The Read Manufacturer/Device ID command is an alternative to the Release from Power-Down / Device ID command that provides both the JEDEC assigned Manufacturer ID and the specific Device ID. The command is initiated by driving the CS# pin low and shifting the command code “90H” followed by a 24-bit address (A23-A0) of 000000H. After which, the Manufacturer ID and the Device ID are shifted out on the falling edge of SCLK with most significant bit (MSB) first as shown below. If the 24-bit address is initially set to 000001H, the Device ID will be read first. Command 0 1 2 3 4 5 6 7 ABH CS# SCLK SI RES1 Stand-by mode Deep Power-down mode t Command 0 1 2 3 4 5 6 7 ABH CS# SCLK SI 8 9 29 30 31 MSB 2 1 0 3 Dummy Bytes 23 22 32 33 34 35 36 37 38 7 6 5 4 3 2 1 0 SO MSB t RES2 Stand-by Mode Deep Power-down Mode High-Z Device ID |
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