MPC866P datasheet(86/92 Pages) FREESCALE

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MPC866/859 Hardware Speciﬁcations

MOTOROLA

Mechanical Data and Ordering Information

15.2

Mechanical Dimensions of the PBGA Package

For more information on the printed-circuit board layout of the PBGA package, including thermal via

design and suggested pad layout, please refer to Plastic Ball Grid Array Application Note (order number:

AN1231/D) available from your local Motorola sales ofﬁce. Figure 79 shows the mechanical dimensions of

the PBGA package.

VDDSYN

Power

GND

F6, F7, F8, F9, F10, F11, F12, F13, F14, G6, G7, G8, G9, G10,

G11, G12, G13, G14, H6, H7, H8, H9, H10, H11, H12, H13, H14,

J6, J7, J8, J9, J10, J11, J12, J13, J14, K6, K7, K8, K9, K10, K11,

K12, K13, K14, L6, L7, L8, L9, L10, L11, L12, L13, L14, M6, M7,

M8, M9, M10, M11, M12, M13, M14, N6, N7, N8, N9, N10, N11,

N12, N13, N14, P6, P7, P8, P9, P10, P11, P12, P13, P14

Power

VDDL

A8, M1, W8, H19, F4, F16, P4, P16, R1

Power

VDDH

E5, E6, E7, E8, E9, E10, E11, E12, E13, E14, E15, F5, F15, G5,

G15, H5, H15, J5, J15, K5, K15, L5, L15, M5, M15, N5, N15, P5,

P15, R5, R6, R7, R8, R9, R10, R11, R12, R13, R14, R15, T14

Power

N/C

D6, D13, D14, U2, V2, T2

No-connect

1 Classic SAR mode only

2 ESAR mode only

Table 39. Pin Assignments (continued)

Name

Pin Number

Type

Freescale Semiconductor, Inc.

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