BMP085

Data sheet

Bosch Sensortec

Rev. 1.2

Page 23

15 October 2009

© Bosch Sensortec GmbH reserves all rights even in the event of industrial property rights. We reserve all rights of disposal such

as copying and passing on to third parties. BOSCH and the symbol are registered trademarks of Robert Bosch GmbH, Germany.

Specifications are subject to change without notice.

5.5 Printed circuit board (PCB) design

Recommended PCB design (top view):

5.6 Moisture sensitivity level and soldering

The BMP085 is classified MSL 1 (moisture sensitivity level) according to IPC/JEDEC standards

J-STD-020D and J-STD-033A.

The device can be soldered Pb-free with a peak temperature of 260°C for 20 to 40 sec. The

minimum height of the solder after reflow shall be at least 50µm. This is required for good

mechanical decoupling between the sensor device and the printed circuit board (PCB).

The BMP085 devices have to be soldered within 6 months after shipment (shelf life). To ensure

good solder-ability, the devices shall be stored at room temperature (20°C).

The soldering process can lead to an offset shift of typically 1hPa.