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VL53L1X bảng dữ liệu(PDF) 31 Page - STMicroelectronics

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VL53L1X bảng dữ liệu(HTML) 31 Page - STMicroelectronics

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VL53L1X
Packaging and labeling
35
8.5
Pb-free solder reflow process
Table 18 and Figure 24 show the recommended and maximum values for the solder profile.
Customers have to tune the reflow profile depending on the PCB, solder paste, and material
used. We expect customers to follow the recommended reflow profile, which is specifically
tuned for VL53L1X package.
For any reason, if a customer must perform a reflow profile which is different from the
recommended one (especially peak >240 °C), this new profile must be qualified by the
customer at their own risk. In any case, the profile has to be within the “maximum” profile
limit described in Table 18.
Figure 24. Solder profile
Note:
Temperature mentioned in Table 18 is measured at the top of the VL53L1X package.
Note:
The component should be limited to a maximum of three passes through this solder profile.
Table 18. Recommended solder profile
Parameters
Recommended
Maximum
Units
Minimum temperature (TS min)
Maximum temperature (TS max)
Time ts (TS min to TS max)
130
200
90-110
150
200
60 - 120
°C
°C
s
Temperature (TL)
Time (tL)
Ramp up
217
55-65
2
217
55 - 65
3
°C
s
°C/s
Temperature (Tp-10)
Time (tp)
Ramp up
-
-
-
235
10
3
°C
s
°C/s
Peak temperature (Tp)
240
245
°C
Time to peak
300
300
s
Ramp down (peak to TL)-4
-6
°C/s



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