SSM3515CCBZ-R7 datasheet(41/41 Pages) AD

tên linh kiện	SSM3515CCBZ-R7

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Data Sheet

SSM3515

Rev. A| Page 41 of 41

OUTLINE DIMENSIONS

2.240

2.200

2.160

1.840

1.800

1.760

BOTTOM VIEW

(BALL SIDE UP)

TOP VIEW

(BALL SIDE DOWN)

BALL A1

IDENTIFIER

0.40

BSC

0.560

0.500

0.440

SIDE VIEW

0.230

0.200

0.170

0.300

0.260

0.220

1.60 REF

1.20 REF

COPLANARITY

0.05

SEATING

PLANE

Figure 76. 20-Ball Wafer Level Chip Scale Package [WLCSP]

(CB-20-10)

Dimensions shown in millimeters

ORDERING GUIDE

Model1

Temperature Range

Package Description

Package Option

SSM3515CCBZ-RL

−40°C to +85°C

20-Ball Wafer Level Chip Scale Package [WLCSP]

CB-20-10

SSM3515CCBZ-R7

−40°C to +85°C

20-Ball Wafer Level Chip Scale Package [WLCSP]

CB-20-10

EVAL-SSM3515Z

Evaluation Board

1 Z = RoHS Compliant Part.

I2C refers to a communications protocol originally developed by Philips Semiconductors (now NXP Semiconductors).

registered trademarks are the property of their respective owners.

D13327-0-1/17(A)

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