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PAM8006A bảng dữ liệu(PDF) 2 Page - Diodes Incorporated |
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PAM8006A bảng dữ liệu(HTML) 2 Page - Diodes Incorporated |
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2 / 13 page ![]() PAM8006A Document number: DSxxxxx Rev. 1 - 0 2 of 13 www.diodes.com April 2013 © Diodes Incorporated PAM8006A A Product Line of Diodes Incorporated Pin Descriptions Pin Number Package Name Function 1, 8, 17, 24 NC Not Connected 2 RINN Negative differential audio input for right channel. 3 RINP Positive differential audio input for right channel. 4 MUTE A logic high on this pin disables the outputs and a logic low enables the outputs. 5 AVDD 5V Analog Supply 6 LINP Positive differential audio input for left channel. 7 LINN Negative differential audio input for left channel. 9, 16 PGNDL Power ground for left channel H-bridge. 10, 15 PVCCL Power supply for left channel H-bridge, not connected to PVCCR or AVCC. 11 LOUTN Class-D 1/2-H-bridge negative output for left channel. 12 BSLN Bootstrap I/O for left channel, negative high-side FET. 13 BSLP Bootstrap I/O for left channel, positive high-side FET. 14 LOUTP Class-D 1/2-H-bridge positive output for left channel. 18 PL Reference voltage for power limit function. 19 V2P5 2.5V Reference for analog cells. 20 AGND Analog Ground 21 VCLAMP Internally generated voltage supply for bootstrap capacitors. 22 AVCC High-voltage analog power supply (8V to 26V) 23 SD Shutdown signal for IC (low= shutdown, high = operational). TTL logic levels with compliance to VCC. 25, 32 PGNDR Power ground for right channel H-bridge. 26, 31 PVCCR Power supply for right channel H-bridge, not connected to PVCCL or AVCC. 27 ROUTP Class-D 1/2-H-bridge positive output for right channel. 28 BSRP Bootstrap I/O for right channel, positive high-side FET. 29 BSRN Bootstrap I/O for right channel, negative high-side FET. 30 ROUTN Class-D 1/2-H-bridge negative output for right channel. 33 Thermal Pad Connect to ground. Thermal pad should be soldered down on all applications to secure the device properly to the printed wiring board. |
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