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ISL8274M bảng dữ liệu(PDF) 35 Page - Renesas Technology Corp |
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ISL8274M bảng dữ liệu(HTML) 35 Page - Renesas Technology Corp |
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35 / 81 page ![]() FN8931 Rev.1.00 Page 35 of 81 Jan 4, 2018 ISL8274M 5. Layout Guide 5.6 Reflow Parameters Due to the low mount height of the HDA, “No-Clean” Type 3 solder paste per ANSI/J-STD-005 is recommended. A nitrogen purge is also recommended during reflow. A system board reflow profile depends on the thermal mass of the entire populated board, so it is not practical to define a specific soldering profile just for the HDA. The profile given in Figure 33 is provided as a guideline, which can be customized for varying manufacturing practices and applications. Figure 33. Typical Reflow Profile 0 300 100 150 200 250 350 0 50 100 150 200 250 300 Duration (s) Slow Ramp (3°C/s Max) and Soak From +150°C to +200°C for 60s~180s Ramp Rate 1.5°C from +70°C to +90°C Peak Temperature ~+245°C; Typically 60s-150s Above +217°C Keep Less than 30s within 5°C of Peak Temp. |
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