MPC862P datasheet(9/88 Pages) MOTOROLA

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MOTOROLA

MPC862/857T/857DSL Hardware Speciﬁcations

Thermal Characteristics

Table 3 shows the thermal characteristics for the MPC862/857T/857DSL.

Table 3. MPC862/857T/857DSL Thermal Resistance Data

Rating

Environment

Symbol

Value

Unit

Junction to ambient 1

1 Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site

(board) temperature, ambient temperature, air ﬂow, power dissipation of other components on the board,

and board thermal resistance.

Natural Convection

Single layer board (1s)

RθJA

2 Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal.

°C/W

Four layer board (2s2p)

RθJMA

3 Per JEDEC JESD51-6 with the board horizontal.

Air ﬂow (200 ft/min)

Single layer board (1s)

RθJMA

Four layer board (2s2p)

RθJMA

Junction to board 4

4 Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature

is measured on the top surface of the board near the package.

RθJB

Junction to case 5

5 Indicates the average thermal resistance between the die and the case top surface as measured by the cold

plate method (MIL SPEC-883 Method 1012.1) with the cold plate temperature used for the case

temperature. For exposed pad packages where the pad would be expected to be soldered, junction to case

thermal resistance is a simulated value from the junction to the exposed pad without contact resistance.

RθJC

Junction to package top 6

6 Thermal characterization parameter indicating the temperature difference between package top and the

junction temperature per JEDEC JESD51-2.

Natural Convection

ΨJT

Air ﬂow (200 ft/min)

ΨJT

Freescale Semiconductor, Inc.

For More Information On This Product,

Go to: www.freescale.com

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