PC33879EKSLASHR2 datasheet(4/20 Pages) MOTOROLA

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33879

MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA

MAXIMUM RATINGS

All voltages are with respect to ground unless otherwise noted.

Rating

Symbol

Value

Unit

VDD Supply Voltage (Note 1)

VDD

-0.3 to 7.0

VDC

, DI, DO, SCLK, IN5, IN6, and EN (Note 1)

–

-0.3 to 7.0

VDC

VPWR Supply Voltage (Note 1)

VPWR

-16 to 40

VDC

Output Clamp Energy (Note 2)

ECLAMP

ESD Voltage

Human Body Model (Note 3)

Machine Model (Note 4)

VESD1

VESD2

±2000

±200

Storage Temperature

TSTG

-55 to 150

°C

Operating Case Temperature

-40 to 125

°C

Operating Junction Temperature

-40 to 150

°C

Maximum Junction Temperature

-40 to 150

°C

Power Dissipation (Note 5)

1.7

Thermal Resistance

Junction-to-Ambient

Between the Die and the Exposed Die Pad

RθJA

RθJC

1.2

°C/W

Notes

Exceeding these limits may cause malfunction or permanent damage to the device.

Maximum output clamp energy capability at 150

°C junction temperature using single non-repetitive pulse method with I = 350 mA.

ESD1 testing is performed in accordance with the Human Body Model (CZAP = 100 pF, RZAP = 1500 Ω).

ESD2 testing is performed in accordance with the Machine Model (CZAP = 200 pF, RZAP = 0 Ω).

Maximum power dissipation at TA = 25°C with no heatsink used.

Freescale Semiconductor, Inc.

For More Information On This Product,

Go to: www.freescale.com

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