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MPXM2102AS bảng dữ liệu(PDF) 238 Page - Motorola, Inc |
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MPXM2102AS bảng dữ liệu(HTML) 238 Page - Motorola, Inc |
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238 / 670 page ![]() MPX4250A MPXA4250A SERIES 3–92 Motorola Sensor Device Data www.motorola.com/semiconductors ORDERING INFORMATION – UNIBODY PACKAGE (CASE 867) The MPX4250A series pressure sensors are available in the basic element package or with pressure port fittings that provide mounting ease and barbed hose connections. Device Type/Order No. Options Case No. Marking MPX4250A Basic Element 867 MPX4250A MPX4250AP Ported Element 867B MPX4250AP ORDERING INFORMATION – SMALL OUTLINE PACKAGE (CASE 482) The MPXA4250A series pressure sensors are available in the basic element package or with a pressure port fitting. Two packing options are offered for each type. Device Type/Order No. Case No. Packing Options Device Marking MPXA4250A6U 482 Rails MPXA4250A MPXA4250A6T1 482 Tape and Reel MPXA4250A MPXA4250AC6U 482A Rails MPXA4250A MPXA4250AC6T1 482A Tape and Reel MPXA4250A INFORMATION FOR USING THE SMALL OUTLINE PACKAGE (CASE 482) MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the surface mount packages must be the correct size to ensure proper solder connection inter- face between the board and the package. With the correct fottprint, the packages will self align when subjected to a solder reflow process. It is always recommended to design boards with a solder mask layer to avoid bridging and short- ing between solder pads. 0.660 16.76 0.060 TYP 8X 1.52 0.100 TYP 8X 2.54 0.100 TYP 8X 2.54 0.300 7.62 Figure 5. SOP Footprint (Case 482) inch mm SCALE 2:1 Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com |
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