MPXM2102AS datasheet(236/670 Pages) MOTOROLA

236 / 670 page

MPX4250A MPXA4250A SERIES

3–90

Motorola Sensor Device Data

www.motorola.com/semiconductors

Figure 2. Cross–Sectional Diagram

(Not to Scale)

FLUOROSILICONE

DIE COAT

WIRE BOND

STAINLESS STEEL

METAL COVER

RTV DIE

BOND

DIE

EPOXY

CASE

LEAD FRAME

SEALED VACUUM REFERENCE

1.0

IPS

470 pF

OUTPUT

+5 V

0.01

GND

Vout

Figure 3. Recommended power supply decoupling

and output filtering.

For additional output filtering, please refer to

Application Note AN1646.

Figure 2 illustrates the absolute pressure sensing chip in

the basic chip carrier (Case 867). A fluorosilicone gel iso-

lates the die surface and wire bonds from the environment,

while allowing the pressure signal to be transmitted to the

sensor diaphragm.

The MPX4250A/MPXA4250A series pressure sensor op-

erating characteristics and internal reliability and qualifica-

tion tests are based on use of dry air as the pressure

media. Media, other than dry air, may have adverse ef-

fects on sensor performance and long–term reliability.

Contact the factory for information regarding media com-

patibility in your application.

Figure 3 shows the recommended decoupling circuit for in-

terfacing the output of the integrated sensor to the A/D input

of a microprocessor or microcontroller.

Figure 4 shows the sensor output signal relative to pres-

sure input. Typical, minimum, and maximum output curves

are shown for operation over temperature range of 0

° to

°C using the decoupling circuit shown in Figure 3. The

output will saturate outside of the specified pressure range.

5.0

4.5

4.0

3.5

3.0

PRESSURE (ref: to sealed vacuum) in kPa

MAX

MIN

2.5

2.0

1.5

1.0

0.5

TYP

TRANSFER FUNCTION:

Vout = VS* (0.004 x P–0.04) ± Error

VS = 5.1 Vdc

TEMP = 0 to 85

°C

Figure 4. Output versus Absolute Pressure

Freescale Semiconductor, Inc.

For More Information On This Product,

Go to: www.freescale.com

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