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MPC7450EC bảng dữ liệu(PDF) 48 Page - Motorola, Inc |
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MPC7450EC bảng dữ liệu(HTML) 48 Page - Motorola, Inc |
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48 / 52 page ![]() 48 MPC7450 RISC Microprocessor Hardware Specifications MOTOROLA Document Revision History and conduction) may vary widely. For these reasons, we recommend using conjugate heat transfer models for the board, as well as system-level designs. 1.10 Document Revision History Table 19 provides a revision history for this hardware specification. Table 19. Document Revision History Document Revision Substantive Change(s) Rev 0 Initial release. Rev 1 Removed CHKS, DX, HPR, IARTRY0, OSHD, SRW[0:1], WAIT from spec and added to TEST signal group; corrected Tables 16 and 17 and respective Notes. Reformatted Table 16. Added CI and WT to list of signals requiring weak pull-up resistors. Updated power consumption specifications in Table 7. Rev 1.1 Corrected Notes in Table 21 and Table 15 for L1_TSTCLK, L2TSTCLK, BVSEL, and L3VSEL. Added pullup/pulldown requirements for factory test signals to Section 1.9.7, “Pull-Up/Pull-Down Resistor Requirements”. Rev 2 Changed nominal core voltage to 1.6 V; 1.8 V core voltage still supported. Updated power consumption specifications in Table 7 and changed low power modes (Doze, Nap, Sleep) to specify ‘Typical’ values. Rev 3 Revised Table 6 to clarify Cin specifications. Removed Table 6, “Thermal Sensor Specifications” and accompanying text; TAU is non-functional on MPC7450. Corrected Parameter names and Notes in Table 9. Corrected Table 21 and Table 15 and added Notes 13 and 14. Removed 25 MHz column from Table 16 and added 83 MHz column. Changed all references to inverted HRESET from HRESET to ¬HRESET for clarity and to be consistent with the MPC7450 RISC Microprocessor Family User’s Manual. Moved Table 11 (Table 13 in prior revisions) to Section 1.5.2.4, “L3 Bus AC Specifications” because these specifications apply to all supported SRAM types, added specification for tAC and all Notes. Corrected Figure 23. Removed Section 1.9.9, “MPX Outstanding Data Tenures (ODT)”. This information is now provided in an Application Note. Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com AR CH IVE D B Y F RE ES CA LE SE MI CO ND UC TO R, INC . |
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