56F8322 datasheet(101/136 Pages) MOTOROLA

101 / 136 page

General Characteristics

56F8322 Technical Data, Rev. 10.0

Freescale Semiconductor

101

Preliminary

1. Theta-JA determined on 2s2p test boards is frequently lower than would be observed in an application. Determined on 2s2p ther-

mal test board.

2. Junction to ambient thermal resistance, Theta-JA (RqJA ), was simulated to be equivalent to the JEDEC specification JESD51-2

in a horizontal configuration in natural convection. Theta-JA was also simulated on a thermal test board with two internal planes

(2s2p, where “s” is the number of signal layers and “p” is the number of planes) per JESD51-6 and JESD51-7. The correct name

for Theta-JA for forced convection or with the non-single layer boards is Theta-JMA.

3. Junction to case thermal resistance, Theta-JC (RqJC ), was simulated to be equivalent to the measured values using the cold

plate technique with the cold plate temperature used as the "case" temperature. The basic cold plate measurement technique is

described by MIL-STD 883D, Method 1012.1. This is the correct thermal metric to use to calculate thermal performance when

the package is being used with a heat sink.

4. Thermal Characterization Parameter, Psi-JT (YJT ), is the "resistance" from junction to reference point thermocouple on top cen-

ter of case as defined in JESD51-2. YJT is a useful value to use to estimate junction temperature in steady-state customer envi-

ronments.

5. Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board) temperature,

ambient temperature, air flow, power dissipation of other components on the board, and board thermal resistance.

6. See Section 12.1 for more details on thermal design considerations.

Table 10-2 56F8322/56F8122 ElectroStatic Discharge (ESD) Protection

Characteristic

Min

Typ

Max

Unit

ESD for Human Body Model (HBM)

2000

—

ESD for Machine Model (MM)

200

—

ESD for Charge Device Model (CDM)

500

—

Table 10-3 Thermal Characteristics6

Characteristic

Comments

Symbol

Value

Unit

Notes

48-pin LQFP

Junction to ambient

Natural Convection

RθJA

°C/W

Junction to ambient (@1m/sec)

RθJMA

°C/W

Junction to ambient

Natural Convection

Four layer board

(2s2p)

RθJMA

(2s2p)

°C/W

1,2

Junction to ambient (@1m/sec)

Four layer board

(2s2p)

RθJMA

°C/W

1,2

Junction to case

RθJC

8°C/W

Junction to center of case

°C/W

4, 5

I/O pin power dissipation

P I/O

User-determined

Power dissipation

P D

P D = (IDD x VDD + P I/O)W

Maximum allowed PD

PDMAX

(TJ - TA) /

θJA

°C

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