STM32L443CC datasheet(191/207 Pages) STMICROELECTRONICS

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DocID028739 Rev 2

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STM32L443CC STM32L443RC STM32L443VC

Package information

204

Figure 54. WLCSP64 - 64-ball, 3.141 x 3.127 mm, 0.35 mm pitch wafer level chip scale

package recommended footprint

b(3)

0.190

0.220

0.250

0.0075

0.0087

0.0098

3.106

3.141

3.176

0.1223

0.1237

0.1250

3.092

3.127

3.162

0.1217

0.1231

0.1245

0.350

0.0138

2.450

0.0965

2.450

0.0965

0.3455

0.0136

0.3385

0.0133

aaa

0.100

0.0039

bbb

0.100

0.0039

ccc

0.100

0.0039

ddd

0.050

0.0020

eee

0.050

0.0020

1. Values in inches are converted from mm and rounded to 4 decimal digits.

2. Back side coating.

3. Dimension is measured at the maximum bump diameter parallel to primary datum Z.

Table 97. WLCSP64 recommended PCB design rules (0.35 mm pitch)

Dimension

Recommended values

Pitch

0.35 mm

Dpad

0.210 mm

Dsm

0.275 mm typ. (depends on the soldermask

registration tolerance)

Stencil opening

0.235 mm

Stencil thickness

0.100 mm

Table 96. WLCSP64 - 64-ball, 3.141 x 3.127 mm, 0.35 mm pitch wafer level chip scale

package mechanical data (continued)

Symbol

millimeters

inches(1)

Min

Typ

Max

Min

Typ

Max

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