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STM32F048C6 bảng dữ liệu(PDF) 96 Page - STMicroelectronics |
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STM32F048C6 bảng dữ liệu(HTML) 96 Page - STMicroelectronics |
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96 / 98 page ![]() Revision history STM32F048C6 STM32F048G6 STM32F048T6 96/98 DocID026007 Rev 6 06-Nov-2015 4 (continued) Updates in Section 5: Memory mapping – Table 16: STM32F048x6 peripheral register boundary addresses - change of “SYSCFG + COMP” to “SYSCFG” Updates in Section 6: Electrical characteristics: –VDDIOx replacibg VDD in Figure 18: TC and TTa I/O input characteristics and Figure 19: Five volt tolerant (FT and FTf) I/O input characteristics – footnote for VIN max value in Table 17: Voltage characteristics, – footnote for max VIN in Table 20: General operating conditions, – addition of tSTART parameter in Table 22: Embedded internal reference voltage, removal of -40°C to 85°C condition and the associated footnote – Table 26: Typical and maximum current consumption from the VBAT supply: removing “code executing from Flash or RAM” – removal of the min value for tSTART parameter in Table 55: TS characteristics – the typical value for R parameter in Table 56: VBAT monitoring characteristics – removal of ResTM parameter line from Table 57: TIMx characteristics and putting all values in new Typ column, substitution of tCOUNTER with tMAX_COUNT, values defined as powers of two –VESD(CDM) class in Table 44: ESD absolute maximum ratings – reorganization of Table 62: I2S characteristics and filling max value of tv(SD_ST) – adding definition of levels in Figure 28: I2S master timing diagram (Philips protocol) Updates in Section 7: Package information : – heading and display of columns in Table 65: WLCSP36 package mechanical data ., – Figure 31: UFQFPN48 package marking example (top view) – Figure 34: WLCSP36 package marking example (top view) – Figure 36: Recommended footprint for UFQFPN28 package distance between corner pads added – Figure 37: UFQFPN28 package marking example (top view) – removing “die 445” from Table 68: Package thermal characteristics Updates in Section 8: Part numbering: – adding tray packing to options 05-Dec-2015 5 Section 4: Pinouts and pin descriptions: – Package pinout figures updated (look and feel) – Figure 4: WLCSP36 package- now presented in top view – Table 12: STM32F048x6 pin definitions - note 3 added; Section 6: Electrical characteristics: – Table 47: I/O static characteristics - removed note – Section 6.3.15: 12-bit ADC characteristics - changed introductory sentence Table 70. Document revision history (continued) Date Revision Changes |
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