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ASP0905 bảng dữ liệu(PDF) 49 Page - Texas Instruments

tên linh kiện ASP0905
Giải thích chi tiết về linh kiện  Mixed-Signal Microcontrollers
PDF  128 Pages
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Trang chủ  http://www.ti.com
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ASP0905 bảng dữ liệu(HTML) 49 Page - Texas Instruments

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MSP430F5529, MSP430F5528, MSP430F5527, MSP430F5526
MSP430F5525, MSP430F5524, MSP430F5522, MSP430F5521
MSP430F5519, MSP430F5517, MSP430F5515, MSP430F5514, MSP430F5513
www.ti.com
SLAS590M – MARCH 2009 – REVISED NOVEMBER 2015
5.48 Flash Memory
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
TEST
PARAMETER
MIN
TYP
MAX
UNIT
CONDITIONS
DVCC(PGM,ERASE) Program and erase supply voltage
1.8
3.6
V
IPGM
Average supply current from DVCC during program(1)
3
5
mA
IERASE
Average supply current from DVCC during erase(1)
6
11
mA
Average supply current from DVCC during mass erase or bank
IMERASE, IBANK
6
11
mA
erase(1)
tCPT
Cumulative program time
See (2)
16
ms
Program and erase endurance
104
105
cycles
tRetention
Data retention duration
TJ = 25°C
100
years
tWord
Word or byte program time
See (3)
64
85
µs
tBlock, 0
Block program time for first byte or word
See (3)
49
65
µs
Block program time for each additional byte or word, except for last
tBlock, 1–(N–1)
See (3)
37
49
µs
byte or word
tBlock, N
Block program time for last byte or word
See (3)
55
73
µs
Erase time for segment, mass erase, and bank erase when
tErase
See (3)
23
32
ms
available.
MCLK frequency in marginal read mode
fMCLK,MRG
0
1
MHz
(FCTL4.MRG0 = 1 or FCTL4.MRG1 = 1)
(1)
Default clock system frequency of MCLK = 1 MHz, ACLK = 32768 Hz, SMCLK = 1 MHz. No peripherals are enabled or active.
(2)
The cumulative program time must not be exceeded when writing to a 128-byte flash block. This parameter applies to all programming
methods: individual word- or byte-write and block-write modes.
(3)
These values are hardwired into the state machine of the flash controller.
5.49 JTAG and Spy-Bi-Wire Interface
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
TEST
PARAMETER
MIN
TYP
MAX
UNIT
CONDITIONS
fSBW
Spy-Bi-Wire input frequency
2.2 V, 3 V
0
20
MHz
tSBW,Low
Spy-Bi-Wire low clock pulse duration
2.2 V, 3 V
0.025
15
µs
Spy-Bi-Wire enable time (TEST high to acceptance of first clock
tSBW, En
2.2 V, 3 V
1
µs
edge)(1)
tSBW,Rst
Spy-Bi-Wire return to normal operation time
15
100
µs
2.2 V
0
5
fTCK
TCK input frequency, 4-wire JTAG(2)
MHz
3 V
0
10
Rinternal
Internal pulldown resistance on TEST
2.2 V, 3 V
45
60
80
k
Ω
(1)
Tools that access the Spy-Bi-Wire interface must wait for the tSBW,En time after pulling the TEST/SBWTCK pin high before applying the
first SBWTCK clock edge.
(2)
fTCK may be restricted to meet the timing requirements of the module selected.
Copyright © 2009–2015, Texas Instruments Incorporated
Specifications
49
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Product Folder Links: MSP430F5529 MSP430F5528 MSP430F5527 MSP430F5526 MSP430F5525 MSP430F5524
MSP430F5522 MSP430F5521 MSP430F5519 MSP430F5517 MSP430F5515 MSP430F5514 MSP430F5513



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