Package information

LED6001

24/26

DocID025575 Rev 3

)

Symbol

Dimensions (mm)

Note

Min.

Typ.

Max.

A1.20

(1)

1. HTSSOP stands for “Thermally Enhanced Variations”.

A1

0.15

A2

0.80

1.00

1.05

b0.19

0.30

c0.09

0.20

D

4.90

5.00

5.10

(2)

2. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusions or gate burrs

shall not exceed 0.15 mm per side.

D1

3.00

(3)

3. The size of exposed pad is variable depending of leadframe design pad size. End user should verify “D1”

and “E2” dimensions for each device application.

E

6.20

6.40

6.60

E1

4.30

4.40

4.50

(4)

4. Dimension “E1” does not include interlead flash or protrusions. Interlead flash or protrusions shall not

exceed 0.25 mm per side.

E2

3.00

(3)

e0.65

L

0.45

0.60

0.75

L1

1.00

k0.00

8.00

aaa

0.10