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FT4222HQ-C-R bảng dữ liệu(PDF) 42 Page - Future Technology Devices International Ltd.

tên linh kiện FT4222HQ-C-R
Giải thích chi tiết về linh kiện  USB2.0 to QuadSPI/I2C Bridge IC
PDF  49 Pages
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nhà sản xuất  FTDI [Future Technology Devices International Ltd.]
Trang chủ  http://www.ftdichip.com
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FT4222HQ-C-R bảng dữ liệu(HTML) 42 Page - Future Technology Devices International Ltd.

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42
FT4222H USB2.0 TO QUADSPI/I2C BRIDGE IC
1.3
Document No.: FT_001011 Clearance No.: FTDI#405
10
Package Parameters
The FT4222H is available in a VQFN-32 package. The solder reflow profile for VQFN-32 is described in
Section 10.3.
10.1
VQFN-32 Package Mechanical Dimensions
Figure 10.1 VQFN-32 Package Dimensions
The FT4222H is supplied in a RoHS compliant leadless VQFN-32 package. The package is lead (Pb) free,
and uses a ‘green’ compound. The package is fully compliant with European Union directive 2002/95/EC.
This package is nominally 5.00mm x 5.00mm. The solder pads are on a 0.5mm pitch. The above
mechanical drawing shows the VQFN-32 package. All dimensions are in millimetres.
The centre pad on the base of the FT4222H is internally connected to GND and the PCB should not have
signal tracking on the top layer under this area. Connect to GND.



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