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FT260Q-R bảng dữ liệu(PDF) 51 Page - Future Technology Devices International Ltd.

tên linh kiện FT260Q-R
Giải thích chi tiết về linh kiện  HID-class USB to UART/I2C Bridge IC
PDF  61 Pages
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nhà sản xuất  FTDI [Future Technology Devices International Ltd.]
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FT260Q-R bảng dữ liệu(HTML) 51 Page - Future Technology Devices International Ltd.

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Copyright © Future Technology Devices International Limited
51
FT260 HID-CLASS USB TO UART/I2C BRIDGE IC
Version 1.1
Document No.: FT_001272 Clearance No.: FTDI#484
10
Package Parameters
The FT260 is available in WQFN-28 and TSSOP-28 package. The solder reflow profile for WQFN-28 and
TSSOP-28 is described in Section 10.5.
10.1
WQFN-28 Package Mechanical Dimensions
Figure 10.1 WQFN-28 Package Dimensions
The FT260Q is supplied in a RoHS2.0 compliant leadless WQFN-28 package. The package is lead (Pb)
free, and uses a ‘green’ compound. The package is fully compliant with European Union REACH
2006/121/EC.
This package is nominally 5.00mm x 5.00mm. The solder pads are on a 0.5mm pitch. The above
mechanical drawing shows the WQFN-28 package. All dimensions are in millimetres.
The centre pad on the base of the FT260Q is internally connected to GND and the PCB should not have
signal tracking on the top layer under this area. Connect to GND.



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