FT234XD-R datasheet(33/37 Pages) FTDI

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FT234XD USB TO BASIC UART IC

Version 1.2

Document No.: FT_000753 Clearance No.: FTDI#324

9.3 Solder Reflow Profile

The FT234XD is supplied in a Pb free DFN-12 package. The recommended solder reflow profile is shown

in Figure 9.35.

Figure 9.3 FT234XD Solder Reflow Profile

The recommended values for the solder reflow profile are detailed in Table 9.1. Values are shown for both

a completely Pb free solder process (i.e. the FT234XD is used with Pb free solder), and for a non-Pb free

solder process (i.e. the FT234XD is used with non-Pb free solder).

Profile Feature

Pb Free Solder Process

Non-Pb Free Solder Process

Average Ramp Up Rate (Ts to Tp)

3°C / second Max.

3°C / Second Max.

Preheat

- Temperature Min (Ts Min.)

- Temperature Max (Ts Max.)

- Time (ts Min to ts Max)

150°C

200°C

60 to 120 seconds

100°C

150°C

60 to 120 seconds

Time Maintained Above Critical Temperature

TL:

- Temperature (TL)

- Time (tL)

217°C

60 to 150 seconds

183°C

60 to 150 seconds

Peak Temperature (Tp)

260°C

240°C

Time within 5°C of actual Peak Temperature

(tp)

20 to 40 seconds

Ramp Down Rate

6°C / second Max.

Time for T= 25°C to Peak Temperature, Tp

8 minutes Max.

6 minutes Max.

Table 9.1 Reflow Profile Parameter Values

Critical Zone: when

T is in the range

T to T

Time, t (seconds)

T = 25º C to T

Preheat

Ramp Up

Ramp

Down

T Max

T Min

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