MPC855 datasheet(7/76 Pages) MOTOROLA

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MOTOROLA

MPC860 Family Hardware Speciﬁcations

Thermal Characteristics

Part IV Thermal Characteristics

Table 4-3 shows the thermal characteristics for the MPC860.

Table 3-2. Maximum Tolerated Ratings

(GND = 0 V)

Rating

Symbol

Value

Unit

Supply Voltage 1

1 The power supply of the device must start its ramp from 0.0 V.

VDDH

–0.3 to 4.0

VDDL

–0.3 to 4.0

KAPWR

–0.3 to 4.0

VDDSYN

–0.3 to 4.0

Input Voltage 2

2 Functional operating conditions are provided with the DC electrical speciﬁcations in Table 6-5. Absolute maximum

ratings are stress ratings only; functional operation at the maxima is not guaranteed. Stress beyond those listed may

affect device reliability or cause permanent damage to the device.

Caution: All inputs that tolerate 5 V cannot be more than 2.5 V greater than the supply voltage. This restriction applies

to power-up and normal operation (that is, if the MPC860 is unpowered, voltage greater than 2.5 V must not be

applied to its inputs).

Vin

GND – 0.3 to VDDH

Temperature 3 (Standard)

3 Minimum temperatures are guaranteed as ambient temperature, T

A. Maximum temperatures are guaranteed as

junction temperature, Tj.

TA(min)

0˚C

Tj(max)

˚C

Temperature 3 (Extended)

TA(min)

–40

˚C

Tj(max)

˚C

Storage Temperature Range

Tstg

–55 to 150

˚C

Table 4-3. MPC860 Thermal Resistance Data

Rating

Environment

Symbol

Rev A

Rev

B, C, D

Unit

Junction to Ambient 1

1 Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board)

temperature, ambient temperature, air ﬂow, power dissipation of other components on the board, and board thermal

resistance.

Natural Convection

Single layer board (1s)

RθJA

°C/W

Four layer board (2s2p)

RθJMA

Air Flow (200 ft/min)

Single layer board (1s)

RθJMA

Four layer board (2s2p)

RθJMA

Junction to Board 4

RθJB

815

Junction to Case 5

RθJC

Junction to Package Top

Natural Convection

ΨJT

Air Flow (200 ft/min)

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