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LPC18S50 bảng dữ liệu(PDF) 4 Page - NXP Semiconductors

tên linh kiện LPC18S50
Giải thích chi tiết về linh kiện  32-bit ARM Cortex-M3 flashless MCU with security features
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LPC18S50 bảng dữ liệu(HTML) 4 Page - NXP Semiconductors

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LPC18S50_S30_S10
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet
Rev. 1 — 23 February 2015
4 of 151
NXP Semiconductors
LPC18S50/S30/S10
32-bit ARM Cortex-M3 microcontroller
4.
Ordering information
4.1 Ordering options
Table 1.
Ordering information
Type number
Package
Name
Description
Version
LPC18S50FET256 LBGA256
Plastic low profile ball grid array package; 256 balls; body 17
 17  1 mm
SOT740-2
LPC18S50FET180 TFBGA180 Thin fine-pitch ball grid array package; 180 balls
SOT570-3
LPC18S30FET256 LBGA256
Plastic low profile ball grid array package; 256 balls; body 17
 17  1 mm
SOT740-2
LPC18S30FET100 TFBGA100 Plastic thin fine-pitch ball grid array package; 100 balls; body 9
 9  0.7 mm SOT926-1
LPC18S30FBD144 LQFP144
Plastic low profile quad flat package; 144 leads; body 20
 20  1.4 mm
SOT486-1
LPC18S10FET100 TFBGA100 Plastic thin fine-pitch ball grid array package; 100 balls; body 9
 9  0.7 mm SOT926-1
LPC18S10FBD144 LQFP144
Plastic low profile quad flat package; 144 leads; body 20
 20  1.4 mm
SOT486-1
Table 2.
Ordering options
Type number
Total
SRAM
LCD Ethernet USB0
(Host,
Device,
OTG)
USB1
(Host,
Device)/
ULPI
interface
ADC
channels
PWM
QEI
GPIO
Package
LPC18S50FET256
200 kB
yes
yes
yes
yes/yes
8
yes
yes
164
LBGA256
LPC18S50FET180
200 kB
yes
yes
yes
yes/yes
8
yes
yes
118
TFBGA180
LPC1S830FET256
200 kB
no
yes
yes
yes/yes
8
yes
yes
164
LBGA256
LPC18S30FET100
200 kB
no
yes
yes
yes/no
4
no
no
49
TFBGA100
LPC18S30FBD144
200 kB
no
yes
yes
yes/no
8
yes
no
83
LQFP144
LPC18S10FET100
136 kB
no
no
no
no
4
no
no
49
TFBGA100
LPC18S10FBD144
136 kB
no
no
no
no
8
yes
no
83
LQFP144



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