HSDP2110S, HSDP2111S, HSDP2112S, HSDP2113S, HSDP2114S, HSDP2115S

2006-01-23

14

Electrical and Mechanical Considerations

Voltage Transient Suppression

For best results power the display and the components that inter-

face with the display to avoid logic inputs higher than V

tionally, the LEDs may cause transients in the power supply line

while they change display states. The common practice is to place

a parallel combination of a 0.01 µF and a 22 µF capacitor between

V

ESD Protection

The input protection structure of the HDSP211XS provides signifi-

cant protection against ESD damage. It is capable of withstanding

discharges greater than 2.0 kV. Take all the standard precautions,

normal for CMOS components. These include properly grounding

personnel, tools, tables, and transport carriers that come in con-

tact with unshielded parts. If these conditions are not, or cannot be

met, keep the leads of the device shorted together or the parts in

antistatic packaging.

Soldering Considerations

The HDSP211XS can be hand soldered with SN63 solder using a

grounded iron set to 260°C.

Wave soldering is also possible following these conditions:

Preheat that does not exceed 93°C on the solder side of the PC

board or a package surface temperature of 85°C. Water soluble

organic acid flux (except carboxylic acid) or rosin-based RMA flux

without alcohol can be used.

Direct contact with alcohol or alcohol vapor will cause degradation

of the package.

Wave temperature of 245°C ±5°C with a dwell between 1.5 sec.

to 3.0 sec. Exposure to the wave should not exceed tempera-

tures above 260°C for five seconds at 0.063" below the seating

plane. The packages should not be immersed in the wave.

Post Solder Cleaning Procedures

The least offensive cleaning solution is hot D.I. water (60°C) for

less than 15 minutes. Addition of mild saponifiers is acceptable. Do

not use commercial dishwasher detergents.

For faster cleaning, solvents may be used. Exercise care in choos-

ing solvents as some may chemically attack the nylon package.

Maximum exposure should not exceed two minutes at elevated

temperatures. Acceptable solvents are TF (trichorotrifluorethane),

TA, 111 Trichloroethane, and unheated acetone.

(1)

Note:

1)

Acceptable commercial solvents are: Basic TF, Arklone, P.

Genesolv, D. Genesolv DA, Blaco-Tron TF and Blaco-Tron TA.

Unacceptable solvents contain alcohol, methanol, methylene

chloride, ethanol, TP35, TCM, TMC, TMS+, TE, or TES. Since

many commercial mixtures exist, contact a solvent vendor for

chemical composition information. Some major solvent manu-

facturers are: Allied Chemical Corporation, Specialty Chemical

Division, Morristown, NJ; Baron-Blakeslee, Chicago, IL; Dow

Chemical, Midland, MI; E.I. DuPont de Nemours & Co., Wilm-

ington, DE.

For further information refer to Appnotes 18 and 19 at

www.osram-os.com

An alternative to soldering and cleaning the display modules is to

use sockets. Naturally, 28 pin DIP sockets .600" wide with .100"

centers work well for single displays. Multiple display assemblies

are best handled by longer SIP sockets or DIP sockets when avail-

able for uniform package alignment. Socket manufacturers are

Aries Electronics, Inc., Frenchtown, NJ; Garry Manufacturing, New

Brunswick, NJ; Robinson-Nugent, New Albany, IN; and Samtec

Electronic Hardward, New Albany, IN.

For further information refer to Appnote 22 at www.osram-os.com

Displaying User Defined Character Example

Load character “A” into UDC-5 and then display it in digit 2

Logic levels: 0=Low, 1=High, X=Don‘t care

RST

CE

WR

RD

FL

A4

A3

A2

A1

A0

D7

D6

D5

D4

D3

D2

D1

D0

Operation

Display

0

X

1

1

1

X

X

X

X

X

X

X

X

X

X

X

X

X

Reset. No Read/Write

Within 3 Clock Cycles

All Blank

1

0

0

1

1

0

0

X

X

X

X

X

X

X

0

1

0

1

Select UDC-5

All Blank

1

0

0

1

1

0

1

0

0

0

X

X

X

0

1

1

1

0

Write into Row 1 of UDC-5

All Blank

1

0

0

1

1

0

1

0

0

1

X

X

X

1

0

0

0

1

Write into Row 2 of UDC-5

All Blank

1

0

0

1

1

0

1

0

1

0

X

X

X

1

0

0

0

1

Write into Row 3 of UDC-5

All Blank

1

0

0

1

1

0

1

0

1

1

X

X

X

1

1

1

1

1

Write into Row 4 of UDC-5

All Blank

1

0

0

1

1

0

1

1

0

0

X

X

X

1

0

0

0

1

Write into Row 5 of UDC-5

All Blank

1

0

0

1

1

0

1

1

0

1

X

X

X

1

0

0

0

1

Write into Row 6 of UDC-5

All Blank

1

0

0

1

1

0

1

1

1

0

X

X

X

1

0

0

0

1

Write into Row 7 of UDC-5

All Blank

1

0

0

1

1

1

1

0

1

0

1

X

X

X

0

1

0

1

Write UDC-5 into Digit 2

(Digit 2) A