HMIC™ Silicon PIN Diode Switches

Rev. V11

MA4SWx10 Series

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Cleanliness

The chips should be handled in a clean environment

free of dust and organic contamination.

Wire / Ribbon Bonding

Thermo compression wedge bonding using 0.003” x

0.00025” ribbon or 0.001” diameter gold wire is

recommended. A work stage temperature of

150°C - 200°C, tool tip temperature of 120°C - 150°

and a downward force of 18 to 22 grams should be

used. If ultrasonic energy is necessary, it should be

adjusted to the minimum level required to achieve a

good bond. Excessive power or force will fracture

the silicon beneath the bond pad causing it to lift.

RF bond wires and ribbons should be kept as short

as possible for optimum RF performance.

Chip Mounting

HMIC switches have Ti-Pt-Au backside metallization

and can be mounted using a gold-tin eutectic solder

or conductive epoxy. Mounting surface must be free

of contamination and flat.

Eutectic Die Attachment

80/20, gold-tin, solder is recommended. A re-flow

oven or hot gas die bonder with a temperature

setting of 290°C is normally used to melt the solder.

The chip should not be exposed to temperatures

greater than 320°C for more than 20 seconds.

Typically no more than three seconds at peak

temperature is required for attachment. RoHS

compliant solders may also be used but solders rich

in tin should be avoided as they will scavenge the

backside gold and/or cause gold embrittlement.

Epoxy Die Attachment

A minimum amount of epoxy, 1 - 2 mils thick, should

be used to attach chip. A thin epoxy fillet should be

visible around the outer perimeter of the chip after

placement. Epoxy cure time is typically 1 hour at

150°C.