GaAs Flip Chip

Schottky Barrier Diodes

Rev. V9

MA4EXXXX Series

3

3

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Parameter

Absolute Maximum

Operating Temperature

-65°C to +125°C

Storage Temperature

-65°C to +150°C

Incident LO Power

+20 dBm

Incident RF Power

+20 dBm

Mounting Temperature

+235°C for 10 seconds

Forward Current vs. Temperature

0

20

40

60

80

100

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

+25°C

-50°C

+125°C

Forward Voltage (V)

5. Exceeding any one or combination of these limits may cause

permanent damage to this device.

6. MACOM does not recommend sustained operation near these

survivability limits.

Mounting Techniques

These chips were designed to be inserted onto

hard or soft substrates with the junction side down.

They can be mounted with conductive epoxy or

with a low temperature solder preform. The die

can also be assembled with the junction side up,

and wire or ribbon bonds made to the pads.

Solder Die Attach:

Solder which does not scavenge gold, such as

Indalloy # 2, is recommended.

Sn-Pb based

solders are not recommended due to solder

embrittlement. Do not expose die to a temperature

greater than 235°C, or greater than 200°C for

longer than 10 seconds. No more than three

seconds of scrubbing should be required for

attachment.

Epoxy Die Attach:

Assembly can be preheated to 125 - 150°C. Use a

minimum amount of epoxy. Cure epoxy as per

manufacturer’s schedule. For extended cure times,

temperatures should be kept below 200°C.

Handling Procedures

The following precautions should be observed to

avoid damaging these chips:

Cleanliness:

The chips should be handled in a clean

environment. Do not attempt to clean die after

installation.

Static Sensitivity:

Schottky barrier diodes are ESD sensitive and can

be damaged by static electricity.

Proper ESD

techniques should be used when handling these

Class 0 devices.

General Handling:

The protective polymer coating on the active areas

of these die provides scratch protection, particularly

for the metal air bridge which contacts the anode.

Die can be handled with tweezers or vacuum

pickups and are suitable for use with automatic

pick-and-place equipment.