LAN89730 datasheet(211/218 Pages) MICROCHIP

tên linh kiện	LAN89730

Giải thích chi tiết về linh kiện	Implements Reduced Power Operating Modes

PDF	218 Pages

Scroll/Zoom	100%

nhà sản xuất	MICROCHIP [Microchip Technology]

Trang chủ	http://www.microchip.com

Logo

211 / 218 page

 2013-2015 Microchip Technology Inc.

DS60001348A-page 211

LAN89730

RECOMMENDED LAND PATTERN

Dimension Limits

Units

Optional Center Pad Width

Contact Pad Spacing

Optional Center Pad Length

Contact Pitch

5.30

MILLIMETERS

0.50 BSC

MIN

MAX

7.90

Contact Pad Length (X56)

Contact Pad Width (X56)

0.85

0.30

Microchip Technology Drawing C04-2374A

NOM

SILK SCREEN

Contact Pad Spacing

7.90

Contact Pad to Center Pad (X52)

0.20

Thermal Via Diameter

Thermal Via Pitch

0.33

1.20

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

Dimensioning and tolerancing per ASME Y14.5M

For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during

reflow process

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

ØV

56L Very Thin Quad Flat, No Lead Package (P6) - 8x8 mm Body [VQFN]

With 5.2x5.2 mm Exposed Pad; Punch Singulated

LAN89730 bảng dữ liệu(PDF) 211 Page - Microchip Technology

LAN89730 bảng dữ liệu(HTML) 211 Page - Microchip Technology

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 ...More

bảng dữ liệu tải về

Link URL