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SST12LF02 bảng dữ liệu(PDF) 2 Page - Microchip Technology

tên linh kiện SST12LF02
Giải thích chi tiết về linh kiện  2.4 GHz WLAN High-Gain, High-Efficiency FEM
PDF  17 Pages
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nhà sản xuất  MICROCHIP [Microchip Technology]
Trang chủ  http://www.microchip.com
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SST12LF02 bảng dữ liệu(HTML) 2 Page - Microchip Technology

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©2015
DS-70005001D
01/15
2
2.4 GHz WLAN High-Gain, High-Efficiency FEM
SST12LF02
Data Sheet
Product Description
SST12LF02 is a 2.4 GHz Front-end Module (FEM) designed in compliance with IEEE 802.11b/g/n
applications. It combines a high-performance Power Amplifier (PA) and a switch. There are three com-
ponents to the FEM: the Receiver (RX) chain, the Transmitter (TX) chain, and the Bluetooth® (BT)
chain.
The TX chain includes a high-efficiency PA based on the InGaP/GaAs HBT technology. This chain typ-
ically provides 29 dB gain with 27% power-added efficiency (PAE) @ POUT = 21 dBm for 802.11g and
26% PAE @ POUT = 21 dBm for 802.11b
The TX chain has excellent linearity, typically ~3% added EVM at 18 dBm output power which is essen-
tial for 54 Mbps 802.11g operation while meeting 802.11g spectrum mask at 21dBm. The SST12LF02
transmitter will also provide up to 17 dBm for 11n, MCS7-HT40 modulation and up to 16 dBm for 256 QAM,
MCS9-HT40 modulation.
SST12LF02 also features easy board-level usage along with high-speed power-up/down controls.
Ultra-low reference current (total IREF ~2 mA) makes SST12LF02 controllable by an on/off switching
signal directly from the baseband chip. These features, coupled with low operating current, make the
SST12LF02 ideal for the final stage power amplification in battery-powered 802.11b/g/n WLAN trans-
mitter applications.
SST12LF02 has an excellent on-chip, single-ended power detector, which features wide-range (>15
dB) with dB-wise linearization. The excellent on-chip power detector provides a reliable solution to
board-level power control.
The input/output RF ports are single-ended and fully matched to 50
internally. These RF ports are
DC decoupled, and require no DC-blocking capacitors or matching components. This helps reduce the
system board Bill of Materials (BOM) cost.
The SST12LF02 is offered in a16-contact XQFN package. See Figure 2 for pin assignments and Table
1 for pin descriptions.



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