USB82640 datasheet(47/64 Pages) MICROCHIP

tên linh kiện	USB82640

Giải thích chi tiết về linh kiện	Automotive USB 2.0 Hub and Flash Media Card Controller Combo

PDF	64 Pages

Scroll/Zoom	100%

nhà sản xuất	MICROCHIP [Microchip Technology]

Trang chủ	http://www.microchip.com

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47 / 64 page

 2010-2015 Microchip Technology Inc.

DS60001312A-page 47

USB82640

8.3

Package Thermal Specifications

8.4

DC Electrical Characteristics

TABLE 8-1:

48-PIN VQFN PACKAGE THERMAL PARAMETERS

Parameter

Symbol

Value

Unit

Comments

Thermal Resistance

ΘJA

°C/W

Measured from the die to the ambient air

Junction-to-Top-of-Package

ΨJT

0.2

°C/W

Note:

Thermal parameters are estimated for devices with the exposed pad soldered to thermal vias in a multi-

layer 2S2P PCB per JESD51.

Parameter

Symbol

Min

Typ

Max

Units

Comments

I, IPU, IPD Type Input Buffer

Low Input Level

VILI

0.8

TTL Levels

High Input Level

VIHI

2.0

Pull Down

µA

Pull Up

µA

ICLK Input Buffer

Low Input Level

VILCK

0.5

High Input Level

VIHCK

1.4

Input Leakage

IIL

-10

+10

µA

VIN = 0 to VDD33

Input Leakage

(All I buffers)

Low Input Leakage

IIL

-10

+10

µA

VIN = 0 V

High Input Leakage

IIH

-10

+10

µA

VIN = VDD33

O12 Type Buffer

Low Output Level

VOL

0.4

IOL = 6 mA @

VDD33 = 3.3 V

High Output Level

VOH

VDD33

- 0.4

VIOH = -6 mA @

VDD33 = 3.3 V

Output Leakage

IOL

-10

+10

µA

VIN = 0 to VDD33

(Note 3)

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