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UCS1001-3 bảng dữ liệu(PDF) 56 Page - Microchip Technology

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UCS1001-3 bảng dữ liệu(HTML) 56 Page - Microchip Technology

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USB Port Power Controller with Charger Emulation
Datasheet
Revision 1.4 (07-16-13)
56
SMSC UCS1001
DATASHEET
Section 4.2.3, "Back-voltage
Detection" and Section
4.2.4, "Back-drive Current
Protection"
Section “Back-voltage / Back-drive Detection” split into two.
In Section 4.2.4, "Back-drive Current Protection", corrected
reference IBD_LK to match elec spec symbol IBD_1 and
rewrote back-drive description.
Section 6.2.4, "Current
Limiting Modes"
Added: The current limiting mode used depends on the Active
state mode (see Section 9.9, "Current Limit Mode
Associations").
Section 6.2.4.1, "Trip Mode"
Added application note: To avoid cycling in trip mode, set ILIM
higher than the highest expected portable device current
draw.
Table 9.2, "Current Limit
Mode Options"
Rearranged rows so DCE Cycle is grouped together.
Added row for DCE Cycle when a charger emulation profile is
being applied.
Section 9.8.2, "Emulation
Cycling"
and
Section 9.11.5, "Legacy 7
Charger Emulation Profile"
Legacy 7 charger emulation profile .
Chapter 10, Typical
Operating Curves
Rearranged order of TOCs.
Added new TOCs:
— Figure 10.3, "Short Applied After Power Up"
— Figure 10.5, "Internal Power Switch Short Response"
— Figure 10.16, "Trip Current Limit Operation vs. Temp."
— Figure 10.17, "IBUS Measurement Accuracy"
— Figure 10.18, "Active State Current vs. Temp"
— Figure 10.19, "Detect State Current vs. Temp"
— Figure 10.20, "Sleep State Current vs. Temp"
Updated the following:
— Figure 10.6, "VBUS Discharge Behavior"
— Figure 10.11, "RDCP_RES Resistance vs.Temp"
— Figure 10.13, "VS Over-Voltage Threshold vs. Temp"
— Figure 10.14, "VS Under Voltage Threshold vs. Temp"
— Figure 10.15, "Detect State VBUS vs. IBUS"
Revision 1.1
(11-21-11)
Table 3.2, "Power
Dissipation Summary"
Missing units added.
Table 3.3, "Electrical
Specifications"
Changed tDET_CHARGE from 400 ms to 800 ms typ and
changed condition from CBUS = 220 µF to CBUS = 500 µF
max.
VS Leakage Current changed from 0.8 µA typical to 2.2 µA.
Changed IBD_1 and IBD_2 from TBD typ to 0 µA typ and from
1.5 µA max to 2 µA max
Changed ITST to ITEST and changed typ from 165 to 190 mA.
Changed tON_PSW from 3 ms to 0.75 ms typical and
tOFF_PSW_INA from 1 ms to 0.75 ms typical.
Table 3.4, "ESD
Ratings"Section 3.1
Charged Device Model: changed from 200 V to 500 V
Note 4.1
Added note: In order to transition from Active state Data Pass-
through mode into Sleep with these settings, change the M1,
M2, and EM_EN pins before changing the PWR_EN pin.
Table 11.1 Customer Revision History (continued)
REVISION
LEVEL & DATE
SECTION/FIGURE/ENTRY
CORRECTION



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