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MIC45116 bảng dữ liệu(PDF) 28 Page - Microchip Technology

tên linh kiện MIC45116
Giải thích chi tiết về linh kiện  20V/6A DC/DC Power Module
PDF  42 Pages
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nhà sản xuất  MICROCHIP [Microchip Technology]
Trang chủ  http://www.microchip.com
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MIC45116 bảng dữ liệu(HTML) 28 Page - Microchip Technology

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MIC45116
DS20005571A-page 28
 2016 Microchip Technology Inc.
7.0
SIMPLIFIED PCB DESIGN
RECOMMENDATIONS
7.1
Periphery I/O Pad Layout and
Large Pad for Exposed Heatsink
The board design should begin with copper/metal pads
that sit beneath the periphery leads of a mounted QFN.
The board pads should extend outside the QFN
package edge a distance of approximately 0.20 mm
per side:
EQUATION 7-1:
After completion of the periphery pad design, the larger
exposed pads will be designed to create the mounting
surface of the QFN exposed heatsink. The primary
transfer of heat out of the QFN will be directly through
the bottom surface of the exposed heatsink. To aid in
the transfer of generated heat into the PCB, the use of
an array of plated through-hole vias beneath the
mounted part is recommended. The typical via hole
diameter is 0.30 mm to 0.35 mm, with center-to-center
pitch of 0.80 mm to 1.20 mm.
FIGURE 7-1:
Package Bottom View vs. PCB Recommended Exposed Metal Trace.
Please note the exposed metal trace is a “mirror image” of the package bottom view.
TotalPadLength
8mm
0.20mm 2sides

8.4mm
=
+
=



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