FEDL610421-02

ML610421

31/31

Notes

1)

The information contained herein is subject to change without notice.

2)

Although LAPIS Semiconductor is continuously working to improve product reliability and quality, semiconductors can

break down and malfunction due to various factors. Therefore, in order to prevent personal injury or fire arising from failure,

please take safety measures such as complying with the derating characteristics, implementing redundant and fire

prevention designs, and utilizing backups and fail-safe procedures. LAPIS Semiconductor shall have no responsibility for

any damages arising out of the use of our Products beyond the rating specified by LAPIS Semiconductor.

3)

Examples of application circuits, circuit constants and any other information contained herein are provided only to illustrate

the standard usage and operations of the Products.The peripheral conditions must be taken into account when designing

circuits for mass production.

4)

The technical information specified herein is intended only to show the typical functions of the Products and examples of

application circuits for the Products.

No license, expressly or implied, is granted hereby under any intellectual property

rights or other rights of LAPIS Semiconductor or any third party with respect to the information contained in this

document; therefore LAPIS Semiconductor shall have no responsibility whatsoever for any dispute, concerning such rights

owned by third parties, arising out of the use of such technical information.

5)

The Products are intended for use in general electronic equipment (i.e. AV/OA devices, communication, consumer systems,

gaming/entertainment sets) as well as the applications indicated in this document.

6)

The Products specified in this document are not designed to be radiation tolerant.

7)

For use of our Products in applications requiring a high degree of reliability (as exemplified below), please contact and

consult with a LAPIS Semiconductor representative: transportation equipment (i.e. cars, ships, trains), primary

communication equipment, traffic lights, fire/crime prevention, safety equipment, medical systems, servers, solar cells, and

power transmission systems.

8)

Do not use our Products in applications requiring extremely high reliability, such as aerospace equipment, nuclear power

control systems, and submarine repeaters.

9)

LAPIS Semiconductor shall have no responsibility for any damages or injury arising from non-compliance with the

recommended usage conditions and specifications contained herein.

10) LAPIS Semiconductor has used reasonable care to

ensure the accuracy of the information contained in this document.

However, LAPIS Semiconductor does not warrant that such information is error-free and LAPIS Semiconductor shall have

no responsibility for any damages arising from any inaccuracy or misprint of such information.

11) Please use the Products in accordance with any applicable environmental laws and regulations, such as the RoHS Directive.

For more details, including RoHS compatibility, please contact a ROHM sales office. LAPIS Semiconductor shall have no

responsibility for any damages or losses resulting non-compliance with any applicable laws or regulations.

12) When providing our Products and technologies contained in this document to other countries, you must abide by the

procedures and provisions stipulated in all applicable export laws and regulations, including without limitation the US

Export Administration Regulations and the Foreign Exchange and Foreign Trade Act.

13) This document, in part or in whole, may not be reprinted or reproduced without prior consent of LAPIS Semiconductor.

Copyright

2011-2015 LAPIS Semiconductor Co., Ltd.

2-4-8 Shinyokohama, Kouhoku-ku,

Yokohama 222-8575, Japan

http://www.lapis-semi.com/en/