21

TUSB1002

www.ti.com

SLLSEU4A – MAY 2016 – REVISED MAY 2016

Product Folder Links: TUSB1002

Submit Documentation Feedback

Copyright © 2016, Texas Instruments Incorporated

9 Power Supply Recommendations

the TUSB1002.

10 Layout

10.1 Layout Guidelines

•

RXP/N and TXP/N pairs should be routed with controlled 90-Ω differential impedance (±15%).

•

Keep away from other high speed signals.

•

Intra-pair routing should be kept to within 2 mils.

•

Length matching should be near the location of mismatch

•

Each pair should be separated at least by 3 times the signal trace width.

•

The use of bends in differential traces should be kept to a minimum. When bends are used, the number of left

and right bends should be as equal as possible and the angle of the bend should be

≥ 135 degrees. This

minimizes any length mismatch causes by the bends; ad therefore, minimize the impact bends have on EMI.

•

Route all differential pairs on the same of layer.

•

The number of VIAS should be kept to a minimum. It is recommended to keep the VIAS count to 2 or less.

•

Keep traces on layers adjacent to ground plane.

•

Do NOT route differential pairs over any plane split.

•

Adding Test points causes impedance discontinuity; and therefore, negatively impact signal performance. If

test points are used, they should be placed in series and symmetrically. They must not be placed in a manner

that causes a stub on the differential pair.