4

TUSB320HI, TUSB320LI

SLLSEP2B – AUGUST 2015 – REVISED SEPTEMBER 2016

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Product Folder Links: TUSB320HI TUSB320LI

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Copyright © 2015–2016, Texas Instruments Incorporated

Pin Functions (continued)

PIN

TYPE

DESCRIPTION

NAME

NO.

TUSB320L

TUSB320H

EN_N

11

—

I

controlled externally, must be held low at least for 50 ms after VDD has reached its valid

voltage level.

EN

—

11

I

Enable signal; active high. Pulled down to GND internally to disable the TUSB320H device. If

controlled externally, must be held low at least for 50 ms after VDD has reached its valid

voltage level.

12

12

P

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Supply voltage

–0.3

6.0

V

Control pins

CC1, CC2, PORT, ADDR, ID, EN_N, INT_N/OUT3

–0.3

V

CC1, CC2

–0.3

6

SDA/OUT1, SCL/OUT2

–0.3

VBUS_DET , EN

–0.3

4

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

±5000

V

Charged-device model (CDM), per JEDEC specification JESD22-

±1500

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Supply voltage range

2.7

5

V

4

5

28

V

TUSB320HI and TUSB320LI Operating free air temperature range

–40

25

85

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and C Package Thermal Metrics application

report, SPRA953.

6.4 Thermal Information

TUSB320

UNIT

RWB (X2QFN)

12 PINS

Junction-to-ambient thermal resistance

169.3

°C/W

Junction-to-case (top) thermal resistance

68.1

°C/W

Junction-to-board thermal resistance

83.4

°C/W

Junction-to-top characterization parameter

2.2

°C/W

Junction-to-board characterization parameter

83.4

°C/W

Junction-to-case (bottom) thermal resistance

N/A